The exact positions of the nozzle and the robot handler are known at all times and are programmable on the X, Y and Z axes. Therefore, any desired position above the wafer can be targeted during the dispense process, which means that dispense rate and dispense path may be set individually.
Advantages:
- Many possibilities for further future process developments, e.g. thick films and high topographies
- Excellent process results, because the position of the nozzle can be repeated at any time
- No adjustments necessary if substrate thickness is changed
