Modular, flexible and individual – our amc machine series

Flexible machine configuration and processing of different wafer sizes:

Wafer diameters: 2“ to 8“
2 I/O carrier stations (open or FOUP)
3 individually selectable processing modules
1 three-link robot handler
Outer dimensions L x W: 975 mm x 1100 mm

Highly flexible machine configuration and processing of different wafer sizes:

Wafer diameters: 2“to 8“
4 I/O stations for 2” to 6” wafers or
2 I/O stations for 8” wafers
5 individually selectable processing modules
1 three-link robot handler
Outer dimensions L x W: 1595 mm x 1360 mm

Wafer diameters: 2“to 8“
4 I/O stations (max. 4 x open or 3 x FOUP)
6 individually selectable processing modules
2 three-link robot handler
Outer dimensions L x W: 1800 mm x 1360 mm

Manual substrate handling
Manual wafer centring system
Hotplates to be loaded from the top
Wafer diameters: 2“ to 450 mm
Customized number of process modules
Outer dimensions L x W: 700 mm x 1100 mm