|The sophisticated product features of our coating equipment are designed to perfect throughput and precision as well as process quality and to lower production costs at the same time.|
|Just before reaching the coater bowl, scanners will determine the position of the wafer on the robot handler and will calculate its necessary movement for an exact centring position on the chuck. A separate positioning station and an extra handling step for positioning become unnecessary.
Servo controlled coating system
Our integrated servo control exactly positions the dispense nozzle above the wafer using absolute values defined in the recipe. Tedious test runs to find the exact position using unspecific relative values become obsolete.
The dispense arm always moves along the two standard axes, therefore the position of the special nozzle above the substrate can be freely selected with the help of servo control. Even spiral dispense is possible. With the optional 3rd axis the distance of the nozzle to the wafer can be set and dispensing in a meandering movement is made possible. Particularly with special applications – e.g. high layer thickness – resist consumption will be drastically reduced whereas uniformity remains at its outstanding level.
When changing resists the machine automatically takes up the dispense nozzle corresponding to the resist specified in the selected recipe.
Dummy dispenses as well as solvent sprays are carried out regularly to avoid drying of the resist nozzles. Therefore, no time-consuming cleaning processes are necessary and the nozzles remain clean and ready to use at any time.
Variety of substrate types
A great variety of substrates within different carrier types can be handled in parallel during one single process without modification of any modules or tools. Regardless of whether your substrates are standard, thick, thin, ultrathin or curved, whether they are round, square or rectangular, whether they are made of glass or sapphire – our amc equipment supports all configurations.
The intelligent carrier scanner with its laser sensors identifies the size of the substrate, the carrier type, whether a substrate is curved or not, substrate thickness, cross or double loaded slots and wafer protrusion.
Thanks to our vast knowledge in the development of special-wafer handlings we are able to offer a broad range of solutions in this field (Edge gripping, contactless Bernoulli-grippers, carbon-, ceramic- or metal-grippers)
Edge Bead Removal
|By entering continuous absolute values in the software recipe the edge bead removal nozzle can be positioned exactly above the wafer edge. So, without tedious trials, the desired width of the edge will be exactly rinsed even with rectangular substrates.
Use of standard components
|Instead of expensive special components amc machines –as far as possible – are equipped with approved quality standard components. These are not only more economic but also easier – independent of manufacturers – to procure and guarantee maximum reliability.
Modifiable machine configuration
|Hard- and software of any amc 1000+ or amc 2000+ are extremely flexible and retrofits can be easily realized at the customer’s site. As standard the machine has got a conversion device built-in to carry through the eventual installation of a third process bowl. Hot- and/or Coolplates may be added.
User-friendliness and security
|The whole electronic system is comfortably accessible from the back of the machine and it has been tightly arranged in one single spot. This placing electronics above the media guiding clearly separates the two areas from each other and so machine failure due to leakage becomes impossible. Bowls, Hot- and Coolplates can easily be removed no tools needed.
Table with protective layer
|The table inside the machine is coated with a chemical-resistant layer.
User-friendly, comfortable software
|amc software is absolutely user-friendly and intuitively to handle – the operator does not need to possess programming knowledge. The flexible and open software architecture can control many different platform configurations and processes. Recipe-controlled product files can easily and variably be created on the machine or the PC.
The sophisticated product features of our coating equipment are designed to perfect throughput and precision as well as process quality and to lower production costs at the same time.